EAN13

9782780398065

Éditeur

Europia productions

Date de publication

1 avril 2001

Collection

Ingéniérie

Dimensions

21 x 2,4 cm

Poids

1030 g

Langue

eng

Benefiting From Thermal And Mechanical Simulation In (Micro)-Electronics

G. Q. Zhang, L. J. Ernst, O. De Saint Leger

Europia productions

Prix public : 100,00 €

The organising and technical committees welcome the participants to the 2nd international conference on "Benefiting from Thermal and Mechanical Simulation in (Micro-) Electronics" (EuroSimE 2001) at Maison de la Chimie, Paris, France. The conference is organised by the thematic network COMPETE (www.compete.tm.fr) with major financial sponsoring by the EC, and technical co-sponsoring by IEEE CPMT and IUTAM. As the only international conference specially dedicated to various mechanical and thermal issues in (micro-) electronics, EuroSimE2001 aims to: - emphasis the fact that (micro-)electronics is becoming a major driven force and impulse for the further development of mechanics, - draw attention from both academic societies and electronic industry for the significant impact of thermal and mechanical related issues on both the electronic industry and modern human life, - demonstrate the state-of-the-art competencies and the challenges facing mechanics professionals, - promote further research and development for mechanics of (micro-) electronics, - promote further development and application of simulation & optimisation methodologies and tools for the electronics industry,

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